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CeramTec @ IMAPS Fall Conference 2026

Munich | October 15–16, 2026

The IMAPS Fall Conference 2026 is one of Germany’s leading specialist events for microelectronics as well as electronic packaging and interconnection technology. The conference focuses on current developments in materials and processes, system integration, modeling and simulation, and the quality and reliability of electronic systems.

Visit CeramTec and discover how advanced technical ceramics support demanding electronic applications. The focus will be on ceramic substrates, heat sinks, piezoceramic components and passive components, as well as technologies for laser processing, metallization and ceramic 3D printing. Our solutions help address the growing demands for thermal management, electrical insulation, reliability and miniaturization in modern electronic systems.

 

Electronic substrates - Selection from CeramTec

What to expect:

  • Our one-stop-shop portfolio for ceramic substrates
  • Innovative and customized solutions for your thermal management
  • Direct conversations with our technical experts

For customers in North America, CeramTec also offers a strong U.S. presence and supply chains outside Asia, helping support supply chain diversification and resilience.

Your Contact Persons on Site

Versatile and customized

CeramTec One Stop Shop

Our One Stop Shop on ceramic substrates and coolers features the most common substrates for electronic applications: From Rubalit®, our proven aluminium oxide; AlN HP, our aluminium nitride (upgrade in summer 2023); Rubalit® ZTA, the zirconium toughened aluminium oxide to our CeramTec silicon nitride (launch in 2024). The range is rounded off by the substrate zirconium oxide ZrO2 and, since 2025, aluminium oxide 98%.

The comprehensive one-stop-shop portfolio of ceramic materials enables our customers to source all important ceramic substrates for power electronics applications from a single European manufacturer, supplement them as needed and streamline their supply chains.

Preview of the HIC Technology Whitepaper by Hans Ulrich Voeller
Whitepaper available for Download

Ceramic-Based Hybrid Integrated Circuits (HICs)

Hans Ulrich Voeller, Senior Product Manager Substrates, analyzes how modern HIC technology forms the foundation for the electronics of tomorrow – from electric vehicles to 5G and AI data centers.
 

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Products & Solutions

Event type On-site
Scheduled
Location Lothstraße 34, 80335 Hochschule München, Germany
Start date 2026-10-15
End date 2026-10-16
Contact
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